At the CES 2025 exhibition, Siemens unveiled its latest digital twin solution, PAVE360, aimed at breaking down traditional silos in the design process within the semiconductor industry. Speaking to EE Times, Mike Ellow, CEO of Siemens EDA, discussed the significance of this innovative approach, especially amid a growing reliance on artificial intelligence (AI) tools that help assess the implications of design adjustments across various system levels.
Ellow highlighted ongoing industry discussions regarding the future trajectory of semiconductor technology, particularly in relation to Moore's law. He noted that while the shrinking of transistor sizes continues to be observable, significant changes are underway in the design paradigms. “I’m not here to say that Moore’s law is dead, because it’s not,” he explained. “But what is interesting is that we’ll move away from these large monolithic SOCs and the manufacturability of those into more discrete silicon with special functionality associated with it.”
This shift is expected to enable customers to better optimise functionality at various process nodes, allowing for assessments of power performance, cost, and yield equations that influence silicon partitioning decisions. Ellow pointed out that some components, such as analog and RF circuits, do not scale down as effectively within lower technology nodes, leading to a strategic separation of digital circuitry.
Looking ahead, Ellow anticipates growth within the chiplet-based economy over the next five to seven years, particularly as the industry establishes data interface standards for chiplet interconnections. He noted the potential for more companies to engage with 3DIC technologies beyond those with significant financial resources, allowing for wider accessibility and application in semiconductor design.
In a bid to enhance the design process, Siemens recently acquired Supplyframe, a company providing real-time supply chain insights for PCB designers. Ellow stated, “With Supplyframe, designers could get a lot of data associated with the parts themselves, including the basics around availability, manufacturability and cost.” He elaborated that integrating this real-time data into the chiplet ecosystem can illuminate the complexities involved in the creation of 3DICs, supporting engineers during the architectural exploration phase of their projects.
Ellow further elaborated on the capabilities of Siemens’ PAVE360 digital twin technology. He described how this solution encompasses all stages from silicon to package, board, and electronics, including a comprehensive multi-physics simulation of the end system. This sophisticated approach allows users to track the Bill of Materials (BOM) throughout the product lifecycle without relying on external systems.
“From a Siemens perspective of a digital twin, it really is now encompassing what is happening from silicon, to package, to board, to electronics,” Ellow stated. The PAVE360 technology facilitates a cloud-based development environment that ensures continuous updates to design models while feeding information back into the digital twin for functionality analysis.
Ellow illustrated the practical applications of this technology through a scenario involving electric vehicles (EVs), where a change in software leading to different power consumption necessitates adjustments in battery configuration. He asserted the need for a more integrated approach within the semiconductor industry, moving beyond the conventional practice of isolating software development from downstream engineering teams.
As the industry advances towards these more integrated design methodologies, Ellow acknowledged Siemens' transition from an industrial conglomerate towards becoming a leader in technology, emphasising the centrality of software in both the company's valuation and its products.
Source: Noah Wire Services