Congatec unveils high-performance Ryzen embedded modules for advanced applications

Congatec Introduces High-Performance Ryzen Embedded 8000-Powered COM Express Modules

Nuremberg, Germany – Congatec, a leading vendor of embedded and edge computing technology, has introduced the conga-TCR8 module series, powered by AMD's latest Ryzen Embedded 8000 chips. These computer-on-modules (COM) aim to push the boundaries of AI inference, graphics, and computing power, tailored for high-demand applications.

The new conga-TCR8 modules feature powerful AMD Ryzen Embedded 8000 Series processors, designed for a spectrum of uses including medical imaging, testing and measurement equipment, AI-integrated point-of-sale/point-of-interaction (POS/POI) systems, and professional gaming hardware. These modules come equipped with either six or eight ‘Zen 4’ cores, integrated AMD Radeon RDNA 3 graphics units, and an XDNA neural processing unit (NPU). The combined operation of these components can deliver an impressive performance of up to 39 tera operations per second (TOPS).

Key Specifications of the Congatec conga-TCR8 Series:

• Processor Options:

  • AMD Ryzen Embedded 8640U: 6 cores, 3.2GHz base frequency up to 4.9GHz, 22MB cache
  • AMD Ryzen Embedded 8645HS: 6 cores, 4.3GHz base frequency up to 5GHz, 22MB cache
  • AMD Ryzen Embedded 8840U: 8 cores, 3.3GHz base frequency up to 5.1GHz, 24MB cache
  • AMD Ryzen Embedded 8845HS: 8 cores, 3.8GHz base frequency up to 5.1GHz, 24MB cache

• Graphics and AI Capabilities:

  • Integrated AMD Radeon RDNA 3 Graphics with up to 12 Compute Units (CUs)
  • Integrated XDNA NPU with up to 16 TOPS, culminating in up to 39 TOPS total SoC performance

• Memory and Storage:

  • Supports up to 64GB DDR5 via two SO-DIMM sockets, up to 5600 MT/s, with ECC
  • Storage options include two SATA 6GB/s and onboard NVMe SSD up to 1TB

• Display and Connectivity:

  • Supports up to four 8K resolution displays
  • Offers numerous peripheral options including six PCIe Gen 4 slots, four USB 3.2 Gen 2 ports, four USB 2.0 ports, and three DisplayPort interfaces

• Networking and Security:

  • 2.5 Gbps Gigabit Ethernet
  • TPM 2.0 security module

• Miscellaneous:

  • Dimensions: 95 x 95mm in a COM Express Type 6 Compact form factor
  • Operating temperature range from 0°C to 60°C, with storage capabilities from -20°C to 80°C

Advanced Features and Ready-to-Use Packages:

Congatec’s new modules are provided as application-ready ‘aReady.COMs’, pre-installed with validated operating systems including Windows 11, Windows 10, ctrlX OS, Ubuntu, and RTLinux. These aReady.COMs come equipt with optional hardware partitioning via aReady.VT and IoT building blocks via aReady.IOT. The modules also support the RTS Real-Time Hypervisor.

Flexibility and Power Management:

Due to the modules’ broad TDP range of 15W to 54W, they can seamlessly upgrade existing designs without extensive modifications. For power management, they adhere to ACPI 6.0 standards with battery support, making them versatile for multiple deployment scenarios.

Availability:

For those interested in integrating the Congatec conga-TCR8 modules into their systems, pricing and detailed specifications are available upon request via Congatec's product page. The company also continues to support a range of operating systems, ensuring versatility and ease of integration across various technological environments.

About Congatec:

Congatec is known for its innovative and high-performance embedded and edge computing solutions, consistently expanding its portfolio to cater to the evolving needs of AI and data-intensive industries.

Source: Noah Wire Services